Multilayer ceramic electronic component

ABSTRACT

A multilayer ceramic electronic component includes a body including an internal electrode alternately arranged with a dielectric layer; and an external electrode disposed on the body and connected to the internal electrode. The internal electrode includes a plurality of nickel (Ni) grains, and a composite layer including tin (Sn) and nickel (Ni) is disposed at a grain boundary of the nickel (Ni) grains.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims the benefit of priority to Korean PatentApplication No. 10-2018-0095349 filed on Aug. 16, 2018 in the KoreanIntellectual Property Office, the disclosure of which is incorporatedherein by reference in its entirety.

BACKGROUND 1. Field

The present disclosure relates to a multilayer ceramic electroniccomponent.

2. Description of Related Art

A multilayer capacitor, which is a type of multilayer ceramic electroniccomponent, is a chip type condenser mounted on the printed circuitboards of various electronic products including display devices such asa liquid crystal display (LCD) and a plasma display panel (PDP), acomputer, a smartphone, a cellular phone, or the like, and functions tocharge or discharge electricity.

Such a multilayer capacitor may be used as a component of variouselectronic devices because of its small size, secured high capacity, andease of mounting. With the recent miniaturization of components ofelectronic devices, there is growing demand for miniaturization and highcapacity in multilayer capacitors.

In order to achieve miniaturization and high capacity in multilayercapacitors, technology capable of forming an internal electrode and adielectric layer having a small thickness is necessary.

Generally, in order to form the internal electrode having the smallthickness, it is necessary to use a metal powder particle that is finerthan an existing powder particle. This is because the presence of 5 to 6fine metal powder particles in the thickness direction of a thinlyprinted internal electrode may prevent a breakage phenomenon that mayoccur during a contraction process.

However, when a metal powder particle that is finer than an existingpowder particle is used, since a contraction start temperature may belowered, a difference in the contraction behavior of the internalelectrode and a ceramic layer increases, which causes a problem in thatthe internal electrode agglomeration phenomenon and the internalelectrode breakage phenomenon may be worsened during the contractionprocess.

SUMMARY

An aspect of the present disclosure may provide a small, high-capacitymultilayer ceramic electronic component with high reliability bysuppressing an electrode breakage phenomenon and an electrodeaggregation phenomenon.

According to an aspect of the present disclosure, a multilayer ceramicelectronic component may include a body including an internal electrodealternately arranged with a dielectric layer; and an external electrodedisposed on the body and connected to the internal electrode, whereinthe internal electrode includes a plurality of nickel (Ni) grains, and acomposite layer including tin (Sn) and nickel (Ni) is disposed at agrain boundary of the nickel (Ni) grains.

According to another aspect of the present disclosure, a multilayerceramic electronic component may include a body including an internalelectrode alternately arranged with a dielectric layer; and an externalelectrode disposed on the body and connected to the internal electrode,wherein the internal electrode includes a plurality of nickel (Ni)grains, and a composite layer including tin (Sn) and nickel (Ni) isdisposed at a grain boundary of the nickel (Ni) grains, wherein thedielectric layer includes a plurality of dielectric grains, wherein tin(Sn) is included at a grain boundary of the plurality of dielectricgrains, wherein a portion of the plurality of dielectric grains have acore-shell structure, and wherein tin (Sn) is included in the shell.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view schematically illustrating a multilayerceramic electronic component according to an exemplary embodiment in thepresent disclosure;

FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1;

FIGS. 3A and 3B are views illustrating ceramic green sheets formanufacturing a multilayer ceramic electronic component according to anexemplary embodiment in the present disclosure;

FIG. 4 is an enlarged view of portion A in FIG. 2;

FIG. 5 is a photograph of internal electrodes and a dielectric layer ofa multilayer ceramic electronic component according to an exemplaryembodiment in the present disclosure;

FIG. 6 is a schematic view schematically illustrating a dielectric layerof a multilayer ceramic electronic component according to anotherexemplary embodiment in the present disclosure; and

FIG. 7 is a photograph of internal electrodes and a dielectric layer ofa multilayer ceramic electronic component according to another exemplaryembodiment in the present disclosure.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments in the present disclosure will now bedescribed in detail with reference to the accompanying drawings.

In the drawings, an X direction may be defined as a first direction, anL direction, or a longitudinal direction, a Y direction as a seconddirection, a W direction or a width direction, and a Z direction as athird direction, a T direction, or a thickness direction.

Multilayer Ceramic Electronic Component

FIG. 1 is a perspective view schematically illustrating a multilayerceramic electronic component 100 according to an exemplary embodiment inthe present disclosure.

FIG. 2 is a cross-sectional view taken along line I-I′ of FIG. 1.

FIGS. 3A and 3B are views illustrating ceramic green sheets formanufacturing the multilayer ceramic electronic component 100 accordingto an exemplary embodiment in the present disclosure.

FIG. 4 is an enlarged view of portion A in FIG. 2.

FIG. 5 is a photograph of internal electrodes 121 and 122 and adielectric layer 111 of the multilayer ceramic electronic component 100according to an exemplary embodiment in the present disclosure.

Hereinafter, the multilayer ceramic electronic component 100 accordingto an exemplary embodiment in the present disclosure will be describedin detail with reference to FIGS. 1 through 5.

The multilayer ceramic electronic component 100 according to anexemplary embodiment in the present disclosure includes a body 110including the internal electrodes 121 and 122 alternately arranged withthe dielectric layer 111; and external electrodes 131 and 132 disposedon the body 110 and connected to the internal electrodes 121 and 122.The internal electrodes 121 and 122 include a plurality of nickel (Ni)grains 121 a. A composite layer 121 b including tin (Sn) and nickel (Ni)is disposed on grain boundaries of the nickel (Ni) grains 121 a.

The dielectric layer 111 and the internal electrodes 121 and 122 arealternately stacked in the body 110.

A specific shape of the body 110 is not particularly limited, but asshown, the body 110 may have a hexahedral shape or a similar shape. Dueto contraction of the ceramic powder included in the body 110 during asintering process, the body 110 may have a substantially hexahedralshape but not a hexahedral shape having completely straight lines.

The body 110 has first and second surfaces 1 and 2 opposing each otherin a thickness direction (a Z direction), third and fourth surfaces 3and 4 connected to the first and second surfaces 1 and 2 and opposingeach other in a width direction (a Y direction), and fifth and sixthsurfaces 5 and 6 connected to the first and second surfaces 1 and 2 andto the third and fourth surfaces 3 and 4 and opposing each other in alongitudinal direction (a Z direction).

The plurality of dielectric layers 111 forming the body 110 are in asintered state. Boundaries between the adjacent dielectric layers 111may be integrated so as to be difficult to confirm without using ascanning electron microscope (SEM).

A raw material forming the dielectric layer 111 is not particularlylimited as long as sufficient electrostatic capacity is obtainabletherewith. For example, the raw material may be barium titanate (BaTiO₃)powder. As the material forming the dielectric layer 111, variousceramic additives, organic solvents, plasticizers, binders, dispersantsand the like may be added to powder such as barium titanate (BaTiO₃)according to the purpose of the present disclosure.

A cover layer 112 formed by stacking dielectric layers in which nointernal electrode is formed may be provided on each of upper and lowerportions of the body 110, i.e. both ends in the thickness direction (Zdirection). The cover layer 112 may serve to maintain reliability of acapacitor against external impacts.

A thickness of the cover layer 112 is not particularly limited. However,the thickness of the cover layer 112 may be 20 μm or less in order tomore easily achieve miniaturization and high capacity of the multilayerceramic electronic component 100.

A thickness of the dielectric layer 111 is not particularly limited.

However, according to the present disclosure, even when thicknesses ofthe dielectric layer 111 and the internal electrodes 121 and 122 arevery small, since it is possible to effectively suppress an increase inthe electrode breaking and aggregation, in order to more easily achievethe miniaturization and high capacity of the of the multilayer ceramicelectronic component 100, the thickness of the dielectric layer 111 maybe 0.4 μm or less.

The thickness of the dielectric layer 111 may mean an average thicknessof the dielectric layer 111 disposed between the first and secondinternal electrodes 121 and 122.

The average thickness of the dielectric layer 111 may be measured byscanning an image of a cross section of the body 110 in thelength-thickness direction (L-T) using a scanning electron microscope(SEM).

For example, with respect to an arbitrary dielectric layer extractedfrom an image obtained by scanning the cross section of the body 110 inthe length-thickness direction (L-T), cut in the center in the widthdirection of the body 110 using a scanning electron microscope (SEM), anaverage value may be measured by measuring the thickness of thedielectric layer at points at equidistant intervals in the longitudinaldirection.

The 30 points at equidistant intervals may be measured by a capacitanceforming portion, a region in which the first and second internalelectrodes 121 and 122 overlap each other.

Next, the internal electrodes 121 and 122 are alternately stacked withthe dielectric layer 111, and may include the first and second internalelectrodes 121 and 122. The first and second internal electrodes 121 and122 are alternately arranged to face each other with the dielectriclayer 111 constituting the body 110 interposed therebetween and may beexposed to the third and fourth surfaces 3 and 4 of the body 110respectively.

At this time, the first and second internal electrodes 121 and 122 maybe electrically separated from each other by the dielectric layer 111disposed in the middle thereof.

A printing method of a conductive paste may use a screen printing methodor a gravure printing method, but the present disclosure is not limitedthereto.

Referring to FIGS. 3A and 3B, the body 110 may be formed by alternatelystacking and then sintering a ceramic green sheet 111 on which the firstinternal electrode 121 is printed and a ceramic green sheet 111 on whichthe second internal electrode 122 is printed.

Referring to FIG. 4, the internal electrodes 121 and 122 include aplurality of nickel (Ni) grains 121 a and 122 a, and composite layers121 b and 122 b including tin (Sn) and nickel (Ni) are arranged in grainboundaries of the nickel (Ni) grains 121 a and 122 a.

Generally, in order to form an internal electrode having a smallthickness, it is necessary to use a metal powder particle that is finerthan an existing powder particle. This is because the presence of 5 to 6fine metal powder particles in the thickness direction of a thinlyprinted internal electrode may suppress the breakage phenomenon during acontraction process.

However, when a metal powder particle that is finer than an existingpowder particle is used, since a contraction start temperature islowered, a difference in the contraction behavior of the internalelectrode and a dielectric layer increases, which causes a problem inwhich the internal electrode agglomeration phenomenon and the internalelectrode breakage phenomenon are worsened during the contractionprocess.

In the present disclosure, the composite layers 121 b and 122 bincluding tin (Sn) and nickel (Ni) are disposed in the grain boundariesof the nickel (Ni) grains 121 a and 122 a to suppress the internalelectrode agglomeration phenomenon and the internal electrode breakagephenomenon, thereby providing the multilayer ceramic electroniccomponent 100 including internal electrodes having a small thickness,with a small thickness deviation, and excellent connectivity.

The nickel (Ni) grains 121 a and 122 a are polyhedrons formed byregularly arranging nickel (Ni) atoms. The composite layers 121 b and122 b including tin (Sn) and nickel (Ni) surround the nickel (Ni) grains121 a and 122 a. The composite layers 121 b and 122 b including tin (Sn)and nickel (Ni) may enclose or substantially enclose the at least onenickel (Ni) grains 121 a and 122 a.

The composite layers 121 b and 122 b including tin (Sn) and nickel (Ni)suppress growth of the nickel (Ni) grains 121 a and 122 a to the outsideand suppress a surface area reduction (sphericalization) of nickel dueto an increase of a sintering temperature and serve to improve theinternal electrode agglomeration phenomenon and the internal electrodebreakage phenomenon.

FIG. 5 is a photograph showing a distribution of tin (Sn) relative tothe internal electrodes 121 and 122 and the dielectric layer 111 of themultilayer ceramic electronic component 100 according to an exemplaryembodiment in the present disclosure.

Referring to FIG. 5, it may be seen that the first and second internalelectrodes 121 and 122 are disposed with the dielectric layer 111therebetween and include the nickel (Ni) grains 121 a and 122 a,respectively, and the composite layers 121 b and 122 b including tin(Sn) and nickel (Ni) are arranged in the grain boundaries of the nickel(Ni) grains 121 a and 122 a.

When a ratio of a length of a portion where an actual internal electrodeis formed relative to the total length of the internal electrodes 121and 122 is defined as a connectivity C of the internal electrodes 121and 122, the composite layers 121 b and 122 b including tin (Sn) andnickel (Ni) may suppress the growth of the nickel (Ni) grains 121 a and122 a to the outside and the surface area reduction (sphericalization)of nickel due to the increase of the sintering temperature, and thus theinternal electrode 121 may satisfy 85%≤C.

Thicknesses of the composite layers 121 b and 122 b including tin (Sn)and nickel (Ni) may be within a range from 1 to 15 nm.

When the thicknesses of the composite layers 121 b and 122 b includingtin (Sn) and nickel (Ni) are less than 1 nm, the composite layers 121 band 122 b including tin (Sn) and nickel (Ni) are nickel (Ni) may notsufficiently suppress the growth of the nickel (Ni) grains 121 a and 122a to the outside and the surface area reduction (sphericalization) ofnickel due to the increase of the sintering temperature, and when thethickness exceeds 15 nm, since the thicknesses of the composite layers121 b and 122 b including tin (Sn) and nickel (Ni) are not uniform, aneffect of suppressing the growth of the nickel (Ni) grains 121 a and 122a to the outside and the surface area reduction (sphericalization) ofnickel due to the increase of the sintering temperature may deteriorate.

The composite layers 121 b and 122 b including tin (Sn) and nickel (Ni)may have a molar ratio of tin (Sn) of 0.0001 or more, based on a totalcontent of the composite layers 121 b and 122 b.

Meanwhile, the thicknesses of the first and second internal electrodes121 and 122 are not particularly limited.

However, according to the present disclosure, even when the thicknessesof the dielectric layer 111 and the internal electrodes 121 and 122 arevery small, since it is possible to effectively suppress an increase inthe electrode breakage and aggregation, in order to more easily achievethe miniaturization and implement high capacitance in the of themultilayer ceramic electronic component 100, the thicknesses of thefirst and second internal electrodes 121 and 122 may be 0.4 μm or less.

The thickness of the first and second internal electrodes 121 and 122may mean an average thickness of the first and second internalelectrodes 121 and 122.

The average thickness of the first and second internal electrodes 121and 122 may be measured by scanning an image of a cross section of thebody 110 in the length-thickness direction (L-T) using a scanningelectron microscope (SEM).

For example, with respect to the arbitrary first and second internalelectrodes 121 and 122 extracted from an image obtained by scanning thecross section of the body 110 in the length-thickness direction (L-T)cut in the center in the width direction of the body 110 using ascanning electron microscope (SEM), an average value may be measured bymeasuring the thickness of the first and second internal electrodes 121and 122 at 30 points at equidistant intervals in the longitudinaldirection.

The 30 points at equidistant intervals may be measured by a capacitanceforming portion, a region in which the first and second internalelectrodes 121 and 122 overlap each other.

The internal electrodes 121 and 122 may be formed of an internalelectrode paste including nickel (Ni) powder. A coating layer includingtin (Sn) may be formed on a surface of the internal electrode paste, orthe nickel (Ni) powder of the internal electrode paste may include tin(Sn) in the form of an alloy. Whether the coating layer is used, or thenickel (Ni) powder includes tin (Sn), the tin (Sn) content may be 1.5 wt% or more, based on a total content of the nickel (Ni) powder.

When the coating layer including tin (Sn) or the nickel (Ni) powderincluding tin (Sn) in the form of the alloy is used, sintering may bedelayed regardless of dispersion.

Also, an average particle diameter of the nickel (Ni) powder may be 100nm or less. If the average particle diameter of the nickel (Ni) powderexceeds 100 nm, the thickness of the internal electrode may be larger.

Also, the internal electrode paste may further include sulfur (S) in acontent of 300 ppm (excluding 0) or less, based on a total content ofthe nickel (Ni) powder.

In general, although a conductive paste for forming the internalelectrode may include sulfur (S), which is a contraction retarder, whenthe content thereof exceeds 300 ppm, there is a possibility that acomposite layer including tin (Sn) and nickel (Ni) will be unevenlyformed after firing.

The external electrodes 131 and 132 are disposed on the body 110 andconnected to the internal electrodes 121 and 122, respectively. As shownin FIG. 2, the external electrodes 131 and 132 may include first andsecond external electrodes 131 and 132 connected to the first and secondinternal electrodes 121 and 122, respectively. Although in the presentembodiment, the multilayer ceramic electronic component 100 has astructure including the two external electrodes 131 and 132, the numberand shapes of the external electrodes 131 and 132 maybe changedaccording to the shapes of the internal electrodes 121 and 122 and otherdifferent purposes.

Meanwhile, the external electrodes 131 and 132 may be formed of anymaterial having electrical conductivity such as metal or the like, andspecific materials may be determined in consideration of electricalcharacteristics, structural stability, and the like, and further, theexternal electrodes 131 and 132 may have a multilayer structure.

For example, the external electrodes 131 and 132 may include electrodelayers 131 a and 132 a disposed on the body 110 and plating layers 131 band 132 b formed on the electrode layers 131 a and 132 a.

More specifically with respect to the electrode layers 131 a and 132 a,for example, the electrode layers 131 a and 132 a may be sinteringelectrodes including a conductive metal and glass, and the conductivemetal may be Cu. Also, the electrode layers 131 a and 132 a may beresin-based electrodes including a plurality of metal particles and aconductive resin.

More specifically with respect to the plating layers 131 b and 132 b,for example, the plating layers 131 b and 132 b may be nickel (Ni)plating layers or tin (Sn) plating layers, may be in the form ofsequentially forming nickel (Ni) plating layers and tin (Sn) platinglayers on the electrode layers 131 a and 132 a, and may include aplurality of nickel (Ni) plating layers and/or a plurality of tin (Sn)plating layers.

The size of the multilayer ceramic electronic component 100 is notparticularly limited.

However, in order to simultaneously achieve the miniaturization andhigher capacity, since the stack number needs to be increase by formingthe dielectric layer 111 and the internal electrodes 121 and 122 havingthe small thicknesses, the effect of suppressing the increase in theelectrode breaking and aggregation according to the present disclosuremay be more remarkable in the multilayer ceramic electronic component100 of 0402 (0.4 mm×0.2 mm) size or less. Therefore, the length of themultilayer ceramic electronic component 100 may be 0.4 mm or less andthe width thereof may be 0.2 mm or less.

Hereinafter, a multilayer ceramic electronic component according toanother exemplary embodiment in the present disclosure will be describedin detail. However, the same components as those of the multilayerceramic electronic component 100 according to an exemplary embodiment inthe present disclosure are omitted to avoid redundant descriptions.

The multilayer ceramic electronic component according to the presentexemplary embodiment in the present disclosure includes the body 110including the internal electrodes 121 and 122 alternately arranged witha dielectric layer 111′; and the external electrodes 131 and 132disposed on the body 110 and connected to the internal electrodes 121and 122 respectively, wherein the internal electrodes 121 and 122include the plurality of nickel (Ni) grains 121 a, and the compositelayer 121 b including tin (Sn) and nickel (Ni) is disposed at a grainboundary of the nickel (Ni) grains 121 a, the dielectric layer 111′includes a plurality of dielectric grains 11 and 11′, tin (Sn) isincluded at a grain boundary of the dielectric grains 11 and 11′, a part11′ of the plurality of dielectric grains 11 and 11′ has a core 11a′-shell 11 b′ structure, and tin (Sn) is included in the shell 11 b′.

FIG. 6 is a schematic view schematically illustrating the dielectriclayer 111′ of a multilayer ceramic electronic component according to thepresent exemplary embodiment in the present disclosure.

FIG. 7 is a photograph of the internal electrodes 121 and 122 and thedielectric layer 111′ of a multilayer ceramic electronic componentaccording to the present exemplary embodiment in the present disclosure.

Referring to FIGS. 6 and 7, the dielectric layer 111′ includes theplurality of dielectric grains 11 and 11′, tin (Sn) is included at agrain boundary 11 c of the dielectric grains 11 and 11′, the part 11′ ofthe plurality of dielectric grains 11 and 11′ has a core 11 a′-shell 11b′ structure, and tin (Sn) is included in the shell 11 b′.

Sn is contained in the grain boundary 11 c and the shell 11 b′ of thedielectric grains 11 and 11′, an excessive diffusion of an additivecomponent may be suppressed, thereby suppressing a growth of thedielectric grains 11 and 11′, and improving insulation resistance andwithstand voltage characteristics.

Also, tin (Sn) is contained in the grain boundary 11 c and the shell 11b′ of the dielectric grains 11 and 11′, thereby further enhancing aneffect of the composite layers 121 b and 122 b including tin (Sn) andnickel (Ni) suppressing the growth of the nickel (Ni) grains 121 a and122 a to the outside and a surface area reduction (sphericalization) ofnickel due to an increase of a sintering temperature, and accordinglyfurther improving the internal electrode agglomeration phenomenon andthe internal electrode breakage phenomenon.

FIG. 7 is a photograph of the internal electrodes 121 and 122 and thedielectric layer 111′ of the multilayer ceramic electronic componentaccording to the present exemplary embodiment in the present disclosure.

Referring to FIG. 7, it may be seen that the first and second internalelectrodes 121 and 122 are disposed with the dielectric layer 111′therebetween and include the nickel (Ni) grains 121 a and 122 arespectively, the composite layers 121 b and 122 b including tin (Sn)and nickel (Ni) are disposed in grain boundaries of the nickel (Ni)grains 121 a and 122 a, and tin (Sn) is included in the shell 11 b′.However, since the grain boundary 11 c of the dielectric grains 11 and11′ is thin, the grain boundary 11 c is not clearly observed in FIG. 7.

A method of including tin (Sn) in the grain boundary 11 c and the shell11 b′ of the dielectric grains 11 and 11′ is not particularly limitedand may use, for example, a method of using a dielectric powder on whichan tin (Sn) coating layer is formed on a surface thereof as a rawmaterial of forming the dielectric layer 111′, including an excessiveamount of tin (Sn) as an additive, or increasing the tin (Sn) contentincluded in an internal electrode conductive paste.

Meanwhile, among the plurality of dielectric grains 11 and 11′, thedielectric grains 11′ having the core 11 a′-shell 11 b′ structure may be20% or more of the entire dielectric grains 11 and 11′, but is notlimited thereto.

The shell may have a molar ratio of tin (Sn) of 0.0001 or more.

As set forth above, according to the exemplary embodiment in the presentdisclosure, since internal electrodes include a plurality of nickel (Ni)grains and composite layers including tin (Sn) and nickel (Ni) aredisposed at a grain boundary of the nickel (Ni) grains, there is aneffect of suppressing the internal electrode agglomeration phenomenonand the internal electrode breakage phenomenon.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope in the presentdisclosure as defined by the appended claims.

What is claimed is:
 1. A multilayer ceramic electronic componentcomprising: a body including an internal electrode alternately arrangedwith a dielectric layer; and an external electrode disposed on the bodyand connected to the internal electrode, wherein the internal electrodeincludes a plurality of nickel (Ni) grains, and a composite layerincluding tin (Sn) and nickel (Ni) is disposed at a grain boundary ofthe nickel (Ni) grains.
 2. The multilayer ceramic electronic componentof claim 1, wherein a thickness of the composite layer including tin(Sn) and nickel (Ni) is within a range from 1 to 15 nm.
 3. Themultilayer ceramic electronic component of claim 1, wherein, in thecomposite layer, a molar ratio of tin (Sn) is greater than or equal to0.0001, based on a total content of the composite layer.
 4. Themultilayer ceramic electronic component of claim 1, wherein thecomposite layer including tin (Sn) and nickel (Ni) substantiallyencloses at least one of the nickel (Ni) grains.
 5. The multilayerceramic electronic component of claim 1, wherein a thickness of thedielectric layer is 0.4 μm or less, and a thickness of the internalelectrode is 0.4 μm or less.
 6. The multilayer ceramic electroniccomponent of claim 1, wherein 85%≤C, where C is a ratio of a length of aportion where an actual internal electrode is formed relative to a totallength of the internal electrode.
 7. The multilayer ceramic electroniccomponent of claim 1, wherein the internal electrode is formed of aninternal electrode paste including a nickel (Ni) powder having a coatinglayer including tin (Sn) on a surface thereof, or a nickel-tin alloy(Ni—Sn) powder, and wherein a content of tin (Sn) is 1.5 wt % or more,based on a total weight of the nickel (Ni).
 8. The multilayer ceramicelectronic component of claim 7, wherein an average particle diameter ofthe nickel (Ni) powder powder is 100 nm or less.
 9. The multilayerceramic electronic component of claim 7, wherein the nickel (Ni) powderfurther includes sulfur (S), and a content of the sulfur (S) is lessthan or equal to of 300 ppm (excluding 0), based on a total content ofthe nickel (Ni) powder.
 10. The multilayer ceramic electronic componentof claim 1, wherein the multilayer ceramic electronic component has alength of 0.4 mm or less and a width of 0.2 mm or less.
 11. A multilayerceramic electronic component comprising: a body including an internalelectrode alternately arranged with a dielectric layer; and an externalelectrode disposed on the body and connected to the internal electrode,wherein the internal electrode includes a plurality of nickel (Ni)grains, and a composite layer including tin (Sn) and nickel (Ni) isdisposed at a grain boundary of the nickel (Ni) grains, wherein thedielectric layer includes a plurality of dielectric grains, wherein tin(Sn) is included at a grain boundary of the plurality of dielectricgrains, wherein a portion of the plurality of dielectric grains have acore-shell structure, and wherein tin (Sn) is included in a shell of thedielectric grains having the core-shell structure.
 12. The multilayerceramic electronic component of claim 11, wherein, in the shell of thedielectric grains having the core-shell structure, a molar ratio of tin(Sn) is greater than or equal to 0.0001, based on a total content of theshell.
 13. The multilayer ceramic electronic component of claim 11,wherein among the plurality of dielectric grains, dielectric grainshaving the core-shell structure are 20% or more of the total number ofdielectric grains.
 14. The multilayer ceramic electronic component ofclaim 11, wherein a thickness of the dielectric layer is 0.4 μm or less,and a thickness of the internal electrode is 0.4 μm or less.
 15. Themultilayer ceramic electronic component of claim 11, wherein themultilayer ceramic electronic component has a length of 0.4 mm or lessand a width of 0.2 mm or less.
 16. The multilayer ceramic electroniccomponent of claim 11, wherein 85%≤C, where C is a ratio of a length ofa portion where an actual internal electrode is formed relative to atotal length of the internal electrode.